Fluoropolymers (PTFE) Etching & Products
Products
FluoroEtch® Safety Solvent
Treatment of Fluoropolymers (PTFE) in preparation for bonding
Materials
Materials
Tapes
Products
Silicone Flat Top Caps
For Powder Coating (600ºF/315ºC)
FC SILICONE FLANGE CAPS
(600°F/315°C)
SM SILICONE CAPS
For Powder Coating (600°F/315°C)
ASTM Silicone “Top Thread” Plugs
(600ºF/315ºC)
TTPP Silcone Weld Nut Pull Plugs
(600ºF/315ºC)
Multi-Purpose (Long Length) Plugs
(600ºF/315ºC)
CPP Silicone Pull Plugs
(600°F/315°C)
CSP Silicone Plugs
For Powder Coating (600°F/315°C)
CF200 COPPER FOIL TAPE
Good Electrical Conductivity, Surface conductivity, shielding of electromagnetic waves and prevention of static charges
PC522 POLYIMIDE ON CLEAR LINER
High temp powder coating, wave soldering, circuit board protection - UL Approved
WSBT White Sand Blasting Tape
Ideal for Sand Blasting
HT11 ON PAPER LINER
Painting, wet spray Hand used in cut custom shapes for prototyping or small jobs
PC400 CLEAR LINER (400ºF/204ºC)
Green Powder Coating Tape on Clear Liner
CPC400
For 2 tone powder coating operations & Holds glass in place during glass tile operations
PG21 Masking Tape
Painting, wet spray
SC1 YELLOW ADHESIVE VINYL (210°F/99°C)
Plating, anodizing
RS100 HIGH-TACK RED PLATING (400°F/204°C)
Anodizing, plating
GC500 WHITE GLASS CLOTH (500°F/260°C)
Thermal spray, sandblasting, high temperature galvanizing
DB100 Blue Powder Coating Tape (400°F/204°C)
For masking irregular shapes and around corners
GREEN POWDER COATING
For anodizing
Materials
Solar Photovoltaic Thin Film Spray Coating and Drying Equipment
Products
UV Curing Systems
Ultra-Violet Processing Line - PC7100 Single/Double Side
IR Drying Oven
Argus 9724 Cross-Convection
Liquid Photo-Imageable (LPI)
Solder Mask Machine Line
Equipment
Materials
Temporary Solder Masks
Products
Materials
Flexible Copper Clad Laminates
Products
Materials
Manual and Semi-Automatic Die Bonders
Products
T-5300-W
Manual Bonder with semi automatic process and Wafer Handling capabilities
T-5300
Manual Bonder with Semi-Automatic process capabilities
T-5100-W
PC controlled Manual Die Bonder Featuring Unique pick-up from wafer
T-5100
PC-Controlled Manual Die Bonder
T-4909-AE
Entry Level Manual Die Bonder
Equipment
Equipment
Semi-Automatic & Manual Wire Bonders
Equipment
Materials
Chip Bonding Tools
Products
Die Bonding & Dispensing Tools
For any die pick and place application
Wedge Bonding Tools (Bonding Wedges)
For ultrasonic aluminum or gold wire wedge bonding
Bonding Capillaries
For standard and ultra-fine pitch thermosonic gold or copper wire bonding
Equipment
Fluoropolymers (PTFE) Etching & Products
Products
Tetra-Etch® Fluorocarbon Etchant
Safe and easy way to etch fluorocarbon polymers for potting and bonding
Materials
Masking Lacquer
Products
Materials