This material requires high resistance against repeated bending and suitability for compact, high parts mounting density PCBs in small electronic devices such as cellular phones, digital cameras and notebook PCs. This material enables high-density 3D interconnection by laminating thin films that offer superior resistance against heat, chemicals and flexural stress on copper clad.

A 2L FCCL that has excellent flexural and sliding characteristics suitable for the small radius of curvature(0.65mm) used in cellular phones, HDD pick-ups, multi-layer FPCs, rigid flex, etc.