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High quality electrodeposited copper foils
IC substrates/SLP
Products
BF-TZA-PKG
DOUBLETHIN-CL
DOUBLETHIN NN
DOUBLETHIN ANPS
DOUBLETHIN ANP
DOUBLETHIN N-TZA
Materials
Smart cards
Products
LPT-YE
Materials
Li-Ion batteries
Products
HTS-PLSP
SR-PLSP
BF-PLSP
Materials
Aerospace
Products
TZA-TZA
Materials
Flexible
Products
TZA-FX
TZA-B-FX
SR-TZA-B-FX
BF-TZA-FX
Materials
High density interconnect
Products
DOUBLETHIN N-TZA
BF-TZA
Materials
High frequency
Products
TWLS-B
TWLS
HFA-LP/HFZ-LP
HFA-B/HFZ-B
BF-HFA/BF-HFZ
BF-NN/BF-NN-HT
Materials
High speed digital & low loss
Products
TZA-B
BF-HFI-LP2
BF-TZA
BF-ANP/BF-ANP-HT
BF-NN/BF-NN-HT
Materials
Epoxy Adhesives & Silicone Materials
Epoxy Adhesives
Engineering Silicones & Biomaterials
Dispensing, Mixing & Curing Systems
Plating, Coating & Masking
General Metal Finishes
PCB & Semiconductor Finishes
Fluoropolymers (PTFE) Etching & Products
Soldar Mask Coating & Curing Systems
Copper Core Plating Racks
Masking Materials & Tapes
High-Purity Copper Anodes & Nickel Chemicals
PCB Fabrication
High quality electrodeposited copper foils
Substrates, Laminates & Prepregs
Masking & Coating
Plating
Reliability testing Services
Lamination Aids
Flying Probe Testing Systems
Drilling & Routing
Wire & Die Bonding
Chip Bonding Tools
Ultrasonic Laserbonder
Fully Automatic Wire Bonders
Manual and Semi-Automatic Die Bonders
Pull/Shear Testing Machines
Semi-Automatic & Manual Wire Bonders
PCB Assembly
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