PCB & Semiconductor Finishes Archives - Tech Knowledge : ידע-טק

General Metal Finishes

Epithas® Ni/Au Process for Under Bump Metallization: Copper

Electroless Palladium, Immersion Gold (EPIG) Copy

Electroless Palladium, Immersion Gold (EPIG)

Acid Copper DC Electroplate Copy

Acid Copper DC Electroplate

MEC Surface Treatments

Materials

General Metal Finishes

CMOS-compatible UBM for Silicon Wafers / SOI Wafers

Epithas® Ni/Au Process for Under Bump Metallization: Copper

Epithas® Ni/Au Process for Under Bump Metallization (UBM): Aluminum / Aluminum Alloys

Electroless Palladium, Immersion Gold (EPIG) Copy

Electroless Palladium, Immersion Gold (EPIG)

KAT Electroless Nickel/ Immersion Gold (ENIG) Copy

KAT Electroless Nickel/ Immersion Gold (ENIG)

Electroless Nickel, Electroless Palladium, Immersion Gold (ENEPIG) Copy

Electroless Nickel, Electroless Palladium, Immersion Gold (ENEPIG)

Materials