Wedge Bonding Tools (Bonding Wedges)
For ultrasonic aluminum or gold wire wedge bonding
The oldest and still commonly used method in semiconductor assembly is wedge-to-wedge wire bonding. SPT offers a wide selection depending on the wire size, using Au or Al wire ranging from .0005”-.003”(13µm-76µm), and large Al wire .003”-.020”(76µm-500µm). Tools for ribbon wire and various TAB applications are also available under this product category.
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