EPO-TEK® thermally conductive, electrically insulating epoxies (TCA) are widely used in many high-tech electronic applications for superior performance & thermal management. Properties range from rigid (providing thermally enhanced circuit protection) to flexible (ideal for CTE mismatches).
High Thermal Management
EPO-TEK products are unparalleled in their performance for effectively removing heat, providing increased dielectric strength and protecting circuits from hostile environments. Most products also available in syringe format Thermal/UV Hybrid Adhesives Epoxy Technology (Epotek) has developed a unique line of UV & Epoxy/UV Hybrid adhesives. Please see UV & UV Hybrid Section for more details.
- Epo-Tek 930-4: Long Pot Life, Low Temperature Cure, Excellent Adhesion To Diverse Substrates, Small Particle Size (≤20um)
- Epo-Tek H74: Thixotropic Paste, Low Outgassing, Superior Chemical & Moisture Resistance, Medium Particle Size (≤50um) T905BN-3, Low Viscosity, Self-Leveling, Ideal For Large Volume Potting & Casting, Large Particle Size (<300um)
Low Stress/Flex/Compliant
This grouping was specially formulated for stress relieving applications such as: large area bonding, potting and thermal cycling.
- Epo-Tek T7109-19*: Low Tg, Low Modulus, High Thermal Conductivity, Room Temperature Curable
- Epo-Tek TD1001*: Low Tg & Modulus, Very Long Pot Life, High Strength, One Component
- Epo-Tek TV2001: Very Low Tg, Low Modulus, High Strength, Excellent Adhesion
* Variations of this formulation available
Thermal/UV Hybrid Adhesives
Epoxy Technology has developed a unique line of UV & Epoxy/UV Hybrid adhesives. Please see UV & UV Hybrid Section of this guide for more details.
Most products also available in syringe format.
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