Chip Bonding Tools

Products

Die Bonding & Dispensing Tools
For any die pick and place application
Wedge Bonding Tools (Bonding Wedges)
For ultrasonic aluminum or gold wire wedge bonding
Bonding Capillaries
For standard and ultra-fine pitch thermosonic gold or copper wire bonding
Equipment

Ultrasonic Laserbonder

Products

Equipment

Fully Automatic Wire Bonders

Products

Equipment

Manual and Semi-Automatic Die Bonders

Products

T-5300-W
Manual Bonder with semi automatic process and Wafer Handling capabilities
T-5100-W
PC controlled Manual Die Bonder Featuring Unique pick-up from wafer
T-5100
PC-Controlled Manual Die Bonder
T-4909-AE
Entry Level Manual Die Bonder
Equipment

Pull/Shear Testing Machines

Products

Equipment

Semi-Automatic & Manual Wire Bonders

Products

Series 58
Fully Automatic Wire Bonders - with Exchangeable Bondheads
Series 56
Desktop Micro Factory Wire Bonder
Series 53
Entry-level Wire Bonders Thin and Heavy Wires
Equipment