Dr. Tresky AG

About

Tresky offers manual and semi-manual Die Bonding solutions for small and medium sized electronics assembly facilities, laboratories and R&D. For now 40 years, Tresky has been perfecting the art of creating handling and pick & place systems.

 

 

Equipment
Learn More About Dr. Tresky AG

Products

Manual and Semi-Automatic Die Bonders
T-5300-W
Manual Bonder with semi automatic process and Wafer Handling capabilities
T-3002-PRO
T-5100-W
PC controlled Manual Die Bonder Featuring Unique pick-up from wafer
T-5100
PC-Controlled Manual Die Bonder
T-4909-AE
Entry Level Manual Die Bonder
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