PC controlled Manual Die Bonder Featuring Unique pick-up from wafer

The T-5100-W version features the same flexibility than the T-5100 and has the additional advantage of handling wafers, which sits below the main table with Tresky’s pneumtatic die ejection system.

The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky’s products, the T-5100-W incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the platform is the industry’s most sophisticated system in its class and with the new intuitive software even easier to operate.

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