2nd Gen Low Flow Polyimide Prepreg

38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.


  • Novel chemistry ensuring faster and more uniform resin cure for minimal and consistent resin flow, preventing excessive flow into clearance/relief areas
  • Improved bond strength to Kapton® polyimide of up to 50% compared with conventional polyimide low-flow or no-flow products
  • Tg = 200°C and expansion characteristics typical of polyimide greatly improves PTH reliability
  • Curable at temperatures as low as 350°F (177°C)
  • Excellent thermal stability
  • Improved bond strength to copper and other metals for excellent performance in heat sink bonding applications
  • Electrical and mechanical properties meeting the requirements of IPC-4101/42
  • Compatible with lead-free processing
  • RoHS/WEEE compliant

Typical Applications:

  • Bonding multilayer rigid-flex boards
  • Finished PCB assemblies requiring excellent thermal stability
  • Dielectric insulators
  • Other applications where minimal and uniform resin flow is required




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