Product information
38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Features:
- Novel chemistry ensuring faster and more uniform resin cure for minimal and consistent resin flow, preventing excessive flow into clearance/relief areas
- Improved bond strength to Kapton® polyimide of up to 50% compared with conventional polyimide low-flow or no-flow products
- Tg = 200°C and expansion characteristics typical of polyimide greatly improves PTH reliability
- Curable at temperatures as low as 350°F (177°C)
- Excellent thermal stability
- Improved bond strength to copper and other metals for excellent performance in heat sink bonding applications
- Electrical and mechanical properties meeting the requirements of IPC-4101/42
- Compatible with lead-free processing
- RoHS/WEEE compliant
Typical Applications:
- Bonding multilayer rigid-flex boards
- Finished PCB assemblies requiring excellent thermal stability
- Dielectric insulators
- Other applications where minimal and uniform resin flow is required