85HP
High Performance Polyimide Laminate and Prepreg

Arlon 85HP’s unique blend of pure polyimide resin and micro-fine proprietary fillers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin flow characteristics and pressed thickness matching standard polyimides.

Features:

  • Minimizes cracking and wicking
  • Tc = 0.5 W/mK, 2x thermal conductivity
  • High Tg (250˚C) pure polyimide
  • Thermal Decomposition Temperature (Td, 5%) of 430˚C
  • T-300 greater than 60 minutes
  • Reduced Z-axis expansion
  • Meets IPC-4101 /40 and /41
  • Balanced glass weave
  • X/Y CTE of 17 ppm/˚C (typical) improved flatness

 

Typical Applications:

  • High process or assembly temperatures (lead-free soldering)
  • Designs with high layer counts and MLB complexity
  • Equipment exposed to extreme temperatures:
    • Defense systems
    • Aircraft engine instrumentation
    • Semiconductor testing (burn-in boards)
    • Petroleum exploration (down-hole drilling)
    • Under-hood automotive
    • Industrial sensor systems
    • Space and satellites
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