51N-LF is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high
reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.


  • Decomposition temperature > 350°C is ideally suited for lead-free solder processing and offers significant improvement over traditional FR-4 Epoxy systems.
  • Multifunctional epoxy resin system with a Glass transition temperature (Tg) of 170°C for optimized thermal cycling PTH reliability
  • Improved bond adhesion over multiple thermal excursions results in better reliability through reflow and rework operations
  • Best-in-class thermal performance for an epoxy system with T260 > 60 minutes, T280 > 30 minutes and T300 = 15 minutes
  • Electrical and mechanical properties meet the requirements of IPC-4101/126 prepreg, modified to be “Low-Flow”
  • Compatible with lead-free solder processing
  • RoHS/WEEE compliant

Typical Applications:

  • Bonding multilayer rigid-flex boards
  • Finished PCB assemblies requiring excellent thermal stability
  • Dielectric insulators
  • Other applications where minimal and uniform resin flow is required
If you have any questions don’t hesitate to contact us directly
or by filling up the form below.

    (All fields are required)


    Feel free to contact us through
    the contact information written below.