51N
51N-LF is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high
reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.
Features:
- Decomposition temperature > 350°C is ideally suited for lead-free solder processing and offers significant improvement over traditional FR-4 Epoxy systems.
- Multifunctional epoxy resin system with a Glass transition temperature (Tg) of 170°C for optimized thermal cycling PTH reliability
- Improved bond adhesion over multiple thermal excursions results in better reliability through reflow and rework operations
- Best-in-class thermal performance for an epoxy system with T260 > 60 minutes, T280 > 30 minutes and T300 = 15 minutes
- Electrical and mechanical properties meet the requirements of IPC-4101/126 prepreg, modified to be “Low-Flow”
- Compatible with lead-free solder processing
- RoHS/WEEE compliant
Typical Applications:
- Bonding multilayer rigid-flex boards
- Finished PCB assemblies requiring excellent thermal stability
- Dielectric insulators
- Other applications where minimal and uniform resin flow is required
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