Flame Retardant Polyimide

35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.


  • Tg greater than 250°C
  • UL recognized as UL-94 V-1
  • Low Z-axis of 1.2% between 50-260°C (vs. 2.5-4.0% for typical high-performance epoxies).
  • Low Z-axis expansion minimizes the risk of latent PTH defects caused during solder reflow and device attachment
  • Decomposition temperature of 407°C (vs. 300-360°C for typical high-performance epoxies) offer outstanding long-term high-temperature performance
  • Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41
  • Toughened, chemistry resists resin fracturing
  • Ideal for lead-free processing
  • RoHS/WEEE compliant


Typical Applications:

  1. PCBs that are subjected to high temperatures during processing, such as lead-free soldering, HASL, IR Reflow
  2. Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down hole drilling, under-hood automotive controls, burn-in boards, or industrial sensors
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