A List of all Solution Categories, Sub Categories and Products

1. Epoxy Adhesives & Silicone Materials
   1. Epoxy Adhesives
      1. Electrically and Thermally Conductive Adhesives
      2. Optical Adhesives
      3. Thermally Conductive Adhesives
      4. UV and UV Hybrid Adhesives
   2. Engineering Silicones & Biomaterials
      1. Biomaterials
      2. Advanced Technologies Silicones
   3. Dispensing, Mixing & Curing Systems
      1. Dispensers
         1. Volumetric Dispenser – Precifluid
         2. Pneumatic Dispensers
         3. Bi Component Dispensing Systems – PR70
         4. Consumables & Accessories
      2. Dosing Guns
         1. Mono-Component Gun
         2. Bi-Component Gun
         3. Soloclamp Gun
      3. Mixers
         1. P.Mix – 200V
      4. UV Curing Systems
         1. e-UV Pen
         2. OmniCure UV Curing Systems
      5. Automatic Dispensing Robots
2. Plating, Coating & Masking
   1. General Metal Finishes
      1. Black Nickel Plating
      2. Electroless Nickel
      3. Thru-Nic Nickel Plating Processes
   2. PCB & Semiconductor Finishes
      1. PCB Finishes
         1. General Metal Finishes
         2. Epithas® Ni/Au Process for Under Bump Metallization: Copper
         3. Electroless Palladium, Immersion Gold (EPIG) Copy
         4. Electroless Palladium, Immersion Gold (EPIG)
         5. Acid Copper DC Electroplate Copy
         6. Acid Copper DC Electroplate
         7. MEC Surface Treatments
      2. Semiconductor Finishes
         1. General Metal Finishes
         2. CMOS-compatible UBM for Silicon Wafers / SOI Wafers
         3. Epithas® Ni/Au Process for Under Bump Metallization: Copper
         4. Epithas® Ni/Au Process for Under Bump Metallization (UBM): Aluminum / Aluminum Alloys
         5. Electroless Palladium, Immersion Gold (EPIG) Copy
         6. Electroless Palladium, Immersion Gold (EPIG)
         7. KAT Electroless Nickel/ Immersion Gold (ENIG) Copy
         8. KAT Electroless Nickel/ Immersion Gold (ENIG)
         9. Electroless Nickel, Electroless Palladium, Immersion Gold (ENEPIG) Copy
         10. Electroless Nickel, Electroless Palladium, Immersion Gold (ENEPIG)
   3. Fluoropolymers (PTFE) Etching & Products
      1. Fluoropolymers (PTFE) Etching
         1. FluoroEtch® Safety Solvent
         2. Fluoropolymer Films and Tapes
         3. PTFE Compounds
         4. PTFE Etching Service
      2. Fluorocarbon Etchant
         1. Tetra-Etch® Fluorocarbon Etchant
   4. Soldar Mask Coating & Curing Systems
      1. Hot Air Leveling Systems
         1. Quicksilver – Hot Air Solder Leveler
      2. Liquid Photo-Imageable (LPI) Spray Coating Machines
         1. Liquid Photo-Imageable (LPI)
      3. Solar Photovoltaic Thin Film Spray Coating and Drying Equipment
         1. IR Drying Oven
      4. UV Curing Systems
         1. UV Curing Systems
   5. Copper Core Plating Racks
      1. Copper Core Plating Racks
   6. Masking Materials & Tapes
      1. Masking Lacquer
         1. Masking Lacquers & Tapes
      2. Tapes
         1. CF200 COPPER FOIL TAPE
         2. PC522 POLYIMIDE ON CLEAR LINER
         3. WSBT White Sand Blasting Tape
         4. HT11 ON PAPER LINER
         5. PC400 CLEAR LINER (400ºF/204ºC)
         6. CPC400
         7. INSPECTION ARROWS
         8. PG21 Masking Tape
         9. SC1 YELLOW ADHESIVE VINYL (210°F/99°C)
         10. RS100 HIGH-TACK RED PLATING (400°F/204°C)
         11. GC500 WHITE GLASS CLOTH (500°F/260°C)
         12. DB100 Blue Powder Coating Tape (400°F/204°C)
         13. PC500 Polyimide Powder Coating Tapes (500°F/260°C)
         14. GREEN POWDER COATING
      3. Plugs
         1. ASTM Silicone “Top Thread” Plugs
         2. TTPP Silcone Weld Nut Pull Plugs
         3. Multi-Purpose (Long Length) Plugs
         4. CPP Silicone Pull Plugs
         5. CSP Silicone Plugs
      4. Caps
         1. Silicone Flat Top Caps
         2. FC SILICONE FLANGE CAPS
         3. SM SILICONE CAPS
   7. High-Purity Copper Anodes & Nickel Chemicals
      1. Cu-Brite™ – Oxygen Free Copper Anodes
      2. Cu-Brite™ – Non-Phosphorized Copper Anodes
      3. Cu-Phos™
3. PCB Fabrication
   1. High quality electrodeposited copper foils
      1. IC substrates/SLP
         1. BF-TZA-PKG
         2. DOUBLETHIN-CL
         3. DOUBLETHIN NN
         4. DOUBLETHIN ANPS
         5. DOUBLETHIN ANP
         6. DOUBLETHIN N-TZA
      2. Smart cards
         1. LPT-YE
      3. Li-Ion batteries
         1. HTS-PLSP
         2. SR-PLSP
         3. BF-PLSP
      4. Aerospace
         1. TZA-TZA
      5. Flexible
         1. TZA-FX
         2. TZA-B-FX
         3. SR-TZA-B-FX
         4. BF-TZA-FX
      6. High density interconnect
         1. DOUBLETHIN N-TZA
         2. BF-TZA
      7. High frequency
         1. TWLS-B
         2. TWLS
         3. HFA-LP/HFZ-LP
         4. HFA-B/HFZ-B
         5. BF-HFA/BF-HFZ
         6. BF-NN/BF-NN-HT
      8. High speed digital & low loss
         1. TZA-B
         2. BF-HFI-LP2
         3. BF-TZA
         4. BF-ANP/BF-ANP-HT
         5. BF-NN/BF-NN-HT
   2. Substrates, Laminates & Prepregs
      1. Polyimide Laminates & Prepregs
         1. 85NT
         2. 51N
         3. 38N
         4. 85HP
         5. 35N
      2. High-Performance Laminate & Prepreg Materials
         1. High Thermal Reliability Materials
         2. RF & Microwave Materials
         3. High Speed Digital Materials
      3. Flexible Copper Clad Laminates
         1. Flexible Copper Clad Laminates
   3. Masking & Coating
      1. Tapes, Plugs & Caps
         1. Silicone Flat Top Caps
         2. FC SILICONE FLANGE CAPS
         3. SM SILICONE CAPS
         4. ASTM Silicone “Top Thread” Plugs
         5. TTPP Silcone Weld Nut Pull Plugs
         6. Multi-Purpose (Long Length) Plugs
         7. CPP Silicone Pull Plugs
         8. CSP Silicone Plugs
         9. CF200 COPPER FOIL TAPE
         10. PC522 POLYIMIDE ON CLEAR LINER
         11. WSBT White Sand Blasting Tape
         12. HT11 ON PAPER LINER
         13. PC400 CLEAR LINER (400ºF/204ºC)
         14. CPC400
         15. INSPECTION ARROWS
         16. PG21 Masking Tape
         17. SC1 YELLOW ADHESIVE VINYL (210°F/99°C)
         18. RS100 HIGH-TACK RED PLATING (400°F/204°C)
         19. GC500 WHITE GLASS CLOTH (500°F/260°C)
         20. DB100 Blue Powder Coating Tape (400°F/204°C)
         21. PC500 Polyimide Powder Coating Tapes (500°F/260°C)
         22. GREEN POWDER COATING
      2. Temporary Solder Masks
         1. PC Flex Mask
         2. PC Flex Mask Non-Ammoniated
         3. Stat-Away Lotion
         4. Wash-A-Spacers
         5. Inspection Arrows
      3. Hot Air Leveling Systems
         1. Quicksilver – Hot Air Solder Leveler
      4. Liquid Photo-Imageable (LPI) Solder Mask Machine Line
         1. Liquid Photo-Imageable (LPI)
      5. Lighting & Displays products
         1. Lighting & Displays products
      6. Photovoltaics products
         1. Photovoltaics products
      7. Solder Masks for Printed Circuit Boards
         1. Solder Masks for Printed Circuit Boards
   4. Plating
      1. Copper Core Plating Racks
         1. Copper Core Plating Racks
      2. High-Purity Copper Anodes & Nickel Chemicals
         1. Nickel Acetate
         2. Nickel Sulfamate
         3. Nickel Chloride
         4. Nickel Bromide
         5. Nickel Sulfate (Liquid and Dry)
      3. Via Filling Acid Copper DC Electroplating
      4. ENIG, ENEPIG, & ENAG Finishes
   5. Reliability testing Services
      1. IPC Approved Testing, Inspection & Certifications
      2. PCB Environmental Reliability Testing - Highly Accelerated Thermal Shock (HATS)
   6. Lamination Aids
      1. Turkey Bags
      2. Presspads
      3. Release Films & Fabrics
   7. Flying Probe Testing Systems
      1. Flying Probe Testing Systems
   8. Drilling & Routing
      1. Laser Drilling & Routing
         1. Optilex II
         2. MXY CCD Systems
         3. Flexible Drilling & Routing Systems
      2. Scoring and Flash Cutting Systems
         1. MBM-Series
         2. SCM412
      3. Mechanical Drilling & Routing Systems
         1. UltraSpeed TRIO
         2. UltraSpeed MONO
4. Wire & Die Bonding
   1. Chip Bonding Tools
      1. Die Bonding & Dispensing Tools
      2. Wedge Bonding Tools (Bonding Wedges)
      3. Bonding Capillaries
   2. Ultrasonic Laserbonder
      1. Ultrasonic Laserbonder
   3. Fully Automatic Wire Bonders
      1. Fully Automatic Wire Bonders
   4. Manual and Semi-Automatic Die Bonders
      1. T-5300-W
      2. T-3002-PRO
      3. T-5100-W
      4. T-5100
      5. T-4909-AE
   5. Pull/Shear Testing Machines
      1. Pull & Shear Testing Systems
   6. Semi-Automatic & Manual Wire Bonders
      1. Series 58
      2. Series 56
      3. Series 53
5. PCB Assembly