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PCB Finishes

Products

Acid Copper DC ElectroplateAcid Copper for “Via filling” Via Filling connects the different layers in buildup technology (stacked vias and vias in pad) manufacturing, enhancing the long-term reliability of the PCB and the package.›Electroless Palladium, Immersion Gold (EPIG)EPIG nickel-free PCB finish is gold wire bondable, solderable, and ideal for HF use. It has opened up a wide, new design avenue for high frequency applications and designs with reduced spacing.›Epithas® Ni/Au Process for Under Bump Metallization: CopperThese under bump metallization steps produce optimum results on copper and copper alloys: PRETREATMENT Cleaner – Epithas MCL-10 acid soak cleaner removes surface soils and contamination and wets the surface to enhance solution transfer.›General Metal FinishesElectroless Nickel NBB Electroless Nickel – this process is bright and robust despite being free of lead and cadmium.›MEC Surface TreatmentsMEC products are formulated to achieve maximum copper roughening, topography for organic adhesion, and as a replacement for mechanical or pumice scrubbing.›

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