For standard and ultra-fine pitch thermosonic gold or copper wire bonding
SPT offers a wide range of bonding capillaries with designs and features optimized for your bonding needs. From standard bonding packages, such as SOIC, TSOP up to complex bonding applications for low-k, stacked die, multi-tier, Cu wire, ultra fine-pitch bonding and many more.
If you have any questions don’t hesitate to contact us directly or by filling up the form below.
✉ sales@tech-knowledge.co.il☎ +972-3-6288000(All fields are required)
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