For ultrasonic aluminum or gold wire wedge bonding
The oldest and still commonly used method in semiconductor assembly is wedge-to-wedge wire bonding. SPT offers a wide selection depending on the wire size, using Au or Al wire ranging from .0005”-.003”(13µm-76µm), and large Al wire .003”-.020”(76µm-500µm). Tools for ribbon wire and various TAB applications are also available under this product category.
If you have any questions don’t hesitate to contact us directly or by filling up the form below.
✉ sales@tech-knowledge.co.il☎ +972-3-6288000(All fields are required)
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