Manual Bonder with Semi-Automatic process capabilities

Tresky’s T-5300 is the flagship of our Die Bonders and adds a motorized, programmable Z-axis, with our True Vertical Technology™, to the repertoire of the universal T-5100, making it extra useful for repetitive processes in small-scale production, where
operator influence must be minimized. The T-5300 really shines in applications with highest
precision requirements, such as flip-chip, or eutectic placement. An optional high-resolution
beam splitter unit allows sub-micron placement accuracy.

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