News & Events

Productronica 2023


We are excited to announce that Tech-Knowledge will be participating in Productronica 2023, which will be taking place in Munich from November 14th to November 17th.

This is an excellent opportunity for you to stay up to date and get exposed to the latest solutions and innovations in the industry:

Die & Wire Bonding:

F&S Bondtec – Manual and semi-automatic wire bonders, manual die bonder, pull & shear systems (booth: B2.434)

F&K Delvotec – Automatic wire bonders for mass production (booth: B2.428)

Dr. Tresky AG – Manual and Semi-automatic Die Bonding solutions for small and medium-sized assembly (booth:B2.313)



Epoxy Technology – Specialty adhesives for advanced technology applications and engineered adhesives (booth: A4.140)


PCB Fabrication (Materials):

Arlon – Specialty high-performance polyimide laminate and prepreg materials for use in a wide variety of PCB applications. (booth: B3.443)

Isola – Laminate materials used to fabricate advanced multilayer printed circuit boards, including for RF/MW and HSD (High-Speed Digital) (booth: B3.125)

Uyemura & Umicore – Finishing technology solutions, including the broadest range of PCB finishes, ENIG, ENEPIG, ENEG, ENAG (booth:B3.420)

Taiyo America – The latest inkjet technology for legend ink offers specialty dielectric inks and via filling inks thermal-cure and UV-cure solder masks (booth: B3.242)

Univertical – High Purity Copper anodes (booth: B2.364)


PCB Fabrication (Machines):

ATG – Flying Probe testing machines. Electrical test solutions for the printed circuit board industry. (booth: B3.203)

Posalux – Drilling & routing systems of PCBs. (booth: B2.361)

SchmollAdvanced mechanical and laser micromachining (booth: B3.415)


*For further information or would like to schedule a meeting, please do not hesitate to contact us at:


If you have any questions don’t hesitate to contact us directly
or by filling up the form below.

    (All fields are required)


    Feel free to contact us through
    the contact information written below.